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Electromigration in Metals Fundamentals to Nano-Interconnects - Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev 2022 PDF Cambridge University Press BOOKS TECHNICAL SCIENCES
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Electromigration in Metals Fundamentals to Nano-Interconnects
Author: Paul S. Ho, Chao-Kun Hu, Martin Gall, Valeriy Sukharev
Year: 2022
Number of pages: 440
Format: PDF
File size: 17.62 MB
Language: ENG

Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids.

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