BOOKS - TECHNICAL SCIENCES - 3D Integration in VLSI Circuits Implementation Technolog...
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644380
644380
3D Integration in VLSI Circuits Implementation Technologies and Applications
Author: Edited by Katsuyuki Sakuma
Year: 2018
Number of pages: 235
Format: PDF
File size: 30,86 MB
Language: ENG
Year: 2018
Number of pages: 235
Format: PDF
File size: 30,86 MB
Language: ENG
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration.
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